Tokyo Electron had 23 patents in artificial intelligence during Q1 2024. Tokyo Electron Ltd filed patents in Q1 2024 for an etching control device optimizing the relationship between etching amount distribution and process parameters, a parameter deriving device for deriving a global optimum solution using a shape simulator, and a plasma processing apparatus with sensors for detecting plasma state and a controller estimating plasma state based on sensor data. GlobalData’s report on Tokyo Electron gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Tokyo Electron grant share with artificial intelligence as a theme is 30% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Etching control device, etching control method, and etching control system (Patent ID: US20240096658A1)
The patent filed by Tokyo Electron Ltd. describes an etching control device that optimizes a model representing the relationship between the distribution of etching amounts on a substrate surface and process parameters controlling multiple nozzles used for etching. The device includes an updating unit to adjust the model parameters, a calculator to determine process parameters based on designated etching amounts, and an operation controller to manage the multiple nozzles using the calculated process parameters.
Furthermore, the claims outline the specific components and functions of the etching control device, including the updating unit optimizing the model based on discharge time, position, and speed of the nozzles, the calculator determining process parameters for designated etching amounts, and the operation controller overseeing the multiple nozzles' operations. The patent also covers an etching control method and system incorporating a measuring device to assess the distribution of etching amounts on a substrate, with the etching control device updating the model parameters based on the measured data to control the multiple nozzles effectively.
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