Tokyo Electron had 13 patents in artificial intelligence during Q4 2023. The patents filed by Tokyo Electron Ltd in Q4 2023 focus on improving plasma processes and addressing chuck degradation challenges in wafer processing. The first patent describes a method of sustaining a plasma in a chamber by adjusting the matching circuit based on feedback signals, while the second patent discusses techniques for monitoring chuck wear and manipulating wafer shape to prevent wafer distortion and downstream fabrication issues. These innovations aim to enhance the efficiency and quality of semiconductor manufacturing processes. GlobalData’s report on Tokyo Electron gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Tokyo Electron grant share with artificial intelligence as a theme is 30% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Systems and methods for plasma process (Patent ID: US20230386789A1)
The patent filed by Tokyo Electron Ltd. describes a method for performing a plasma process by generating RF signals at different frequencies to ignite and sustain a plasma within a plasma chamber. The method involves using a matching circuit to adjust variable components based on feedback from the RF signals, ensuring the plasma is sustained to process a substrate loaded into the chamber. The system includes a controller with a machine learning model to determine optimal frequencies and configurations for efficient plasma processing.
The method outlined in the patent involves precise control of the RF signals and matching circuit to ignite and sustain the plasma, ensuring consistent power delivery to the plasma chamber. By utilizing feedback from voltage-current sensors and machine learning models, the system can optimize the process frequency and ignition frequency for efficient substrate processing. The method also includes techniques such as frequency stepping and frequency sweeps to determine the ignition frequency accurately, enhancing the overall performance of the plasma process.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
