KLA had three patents in advanced materials during Q4 2023. The patents filed by KLA Corp in Q4 2023 focus on improving exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings. This involves using a registration unit with entocentric cameras arranged in a linear alignment to create a scanning area over the substrate. Additionally, a metrology system with an imaging system, objective lens, detectors, and proximity sensors is described for measuring metrology associated with targets on a sample using lateral positions of a stage element. GlobalData’s report on KLA gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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KLA grant share with advanced materials as a theme is 33% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits (Patent ID: US20230333492A1)
The patent filed by KLA Corp. describes a device and method for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings. The invention involves a registration unit with entocentric cameras arranged in a linear alignment to create a gapless linear scanning area over the substrate. The angles of view of adjacent cameras overlap to detect redundant image captures, allowing for the calculation of target mark positions using triangulation. The device also includes a processing unit for controlling the alignment between the processing path and the substrate based on the position of the target marks.
Furthermore, the patent claims detail various aspects of the device, such as the arrangement of entocentric cameras, the use of line cameras to form a narrow scanning area, and the integration of focus tracking for substrate height variations. The method outlined in the patent involves detecting target marks on the substrate using entocentric cameras, determining their positions through triangulation, and calculating data for aligning and adjusting the photolithographic processing. Additionally, the method includes fast focus adjustment based on the detected structures on the substrate, with a frequency higher than conventional scanning rates. Overall, the invention aims to improve exposure control in direct exposure methods for two-dimensional structures by utilizing advanced camera technology and triangulation techniques.
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