Fujitsu had 37 patents in connectivity during Q2 2024. Fujitsu Ltd filed a patent for an optical connection structure involving two silicon photonic chips with optical waveguides bridging the gap between them. The structure includes cladding, core, and silicon substrates to facilitate optical communication. GlobalData’s report on Fujitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Fujitsu had no grants in connectivity as a theme in Q2 2024.
Recent Patents
Application: Optical connection structure and optical module (Patent ID: US20240134118A1)
The patent filed by Fujitsu Ltd. describes an optical connection structure involving two silicon photonic chips with waveguides connected by an optical waveguide. The structure includes a core covering the ends of the waveguides and a cladding filling the space between the chips. The design allows for efficient optical connection between the chips.
The claims detail various aspects of the optical connection structure, including the narrowing width of the waveguide ends, attachment to a support substrate with adhesive layers, protective films for the waveguides, and the presence of electrode pads for external connection. Additionally, the claims mention the inclusion of light emitting and receiving devices on the chips, the possibility of multiple waveguides and cores, and the use of an interconnect substrate for mounting the chips in an optical module. These features highlight the versatility and potential applications of the optical connection structure in various optical systems.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
