Powertech Technology has filed a patent for a package device and its manufacturing method. The device includes a substrate, conductive pillars, a bridge chip, a photosensitive encapsulation layer, a redistribution layer, and active chips. The bridge chip is placed between the active chips, and the photosensitive encapsulation layer surrounds the bridge chip and conductive pillars. The patent claim provides a detailed description of the components and their arrangement in the package device. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of September 2023 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Package device with conductive pillars, bridge chip, and active chips
A recently filed patent (Publication Number: US20230290730A1) describes a package device and a manufacturing method for the device. The package device includes a substrate with a plurality of conductive pillars and at least one bridge chip. The bridge chip is surrounded by a photosensitive encapsulation layer, with a smaller distance between the top surface of the bridge chip and the top surface of the encapsulation layer compared to the distance between the top surface of the conductive pillars and the encapsulation layer. A redistribution layer is disposed on the encapsulation layer, and at least two active chips are placed on the redistribution layer. The bridge chip is coupled between the active chips, and an encapsulant surrounds the active chips.
The package device may also include an adhesive layer between the bridge chip and the substrate. The photosensitive encapsulation layer has first and second through holes, with the first holes exposing the conductive pillars and the second holes exposing the pads on the bridge chip. The width and depth of the first holes may be greater than the second holes. The photosensitive encapsulation layer can be placed between the bridge chip and the redistribution layer. The bridge chip does not have any bumps, and the Young's modulus of the encapsulant is greater than the Young's modulus of the photosensitive encapsulation layer. The redistribution layer is positioned between the bridge chip and the active chips. Additionally, an underfill layer may be present between the photosensitive layer and the substrate.
The manufacturing method involves forming the conductive pillars and placing the bridge chip on a carrier. A photosensitive encapsulation layer is formed around the conductive pillars and the bridge chip, with a smaller distance between the top surface of the bridge chip and the top surface of the encapsulation layer compared to the distance between the top surface of the conductive pillars and the encapsulation layer. A redistribution layer is formed on the encapsulation layer, and at least two active chips are placed on the redistribution layer. An encapsulant is formed on the redistribution layer, and the carrier is removed. The bridge chip can be bonded to the carrier using an adhesive layer. The photosensitive encapsulation layer may have first and second through holes, with the first holes exposing the conductive pillars and the second holes exposing the pads on the bridge chip. The photosensitive encapsulation layer can be placed between the bridge chip and the redistribution layer. The Young's modulus of the photosensitive encapsulation layer is less than the Young's modulus of the encapsulant. The manufacturing method may also involve thinning the encapsulant to expose the back surfaces of the active chips and performing an automated optical inspection on the redistribution layer before placing the active chips. Conductive terminals can be formed on the surfaces of the conductive pillars, and an underfill layer can be formed between the photosensitive encapsulation layer and the substrate.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
