Amplitude has patented a method for laser cutting dielectric or semiconductor materials using bursts of femtosecond laser pulses. By spatially separating and concentrating the laser beams, the method initiates a straight micro-fracture for precise cutting. The technique ensures localized modifications without material ablation or microbubbles. GlobalData’s report on Amplitude gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amplitude, Customized implants was a key innovation area identified from patents. Amplitude's grant share as of February 2024 was 100%. Grant share is based on the ratio of number of grants to total number of patents.
Laser cutting method for dielectric or semiconductor materials
A recently granted patent (Publication Number: US11883903B2) outlines a method for laser cutting dielectric or semiconductor materials. The method involves emitting a laser beam in single-pulse mode at a specific wavelength within a transparency spectral band of the material, with bursts of laser pulses separated by defined time intervals. The energy of the split beams is concentrated in distinct areas of the material to produce localized modifications without material ablation or microbubbles. By adjusting the distance between these areas, an oriented rectilinear micro-fracture can be initiated, facilitating precise cutting along a predetermined direction.
Furthermore, the patent details variations in the spatial distribution of the split beams, such as using Bessel beam spatial distribution, and the generation of multiple spatially-split beams for more complex cutting patterns. Additional steps include relative displacement between the split beams and the material, as well as the application of another laser beam to induce thermal stress without causing further micro-fracturing. These innovations aim to enhance the precision and efficiency of laser cutting processes for dielectric and semiconductor materials, offering a novel approach to achieving intricate cuts without damaging the material.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
